ǧÀïÖ®ÐУ¬Ê¼ÓÚ×ãÏ¡£³õѧÕßÔÚѧϰPCBÉè¼Æʱ£¬Ç§Íò²»Äܸ¡Ô꣬ÔúÔúʵʵµØ´òºÃ»ù´¡²ÅÊÇÓ²µÀÀí¡£Ïë³ÉΪһÃûÓÅÐãµÄPCB¹¤³Ìʦ£¬Ò»Ð©ÐÐÒµÊõÓïÄã±ØÐëÒªÖªµÀ¡£
1¡¢PCB Ó¡ÖƵç·°å
PCB£¨ Printed Circuit Board£©£¬ÖÐÎÄÃû³ÆΪӡÖƵ緰壬ÓÖ³ÆÓ¡Ë¢Ïß·°å£¬ÊÇÖØÒªµÄµç×Ó²¿¼þ£¬Êǵç×ÓÔªÆ÷¼þµÄÖ§³ÅÌ壬Êǵç×ÓÔªÆ÷¼þµçÆøÁ¬½ÓµÄÔØÌå¡£ÓÉÓÚËüÊDzÉÓõç×ÓÓ¡Ë¢ÊõÖÆ×÷µÄ£¬¹Ê±»³ÆΪ¡°Ó¡Ë¢¡±µç·°å¡£
2¡¢SMT ±íÃæ×é×°¼¼Êõ
SMTÊDZíÃæ×é×°¼¼Êõ£¨±íÃæÌù×°¼¼Êõ£©£¨Surface Mount TechnologyµÄËõд£©£¬³ÆΪ±íÃæÌù×°»ò±íÃæ°²×°¼¼Êõ¡£ÊÇÄ¿Ç°µç×Ó×é×°ÐÐÒµÀï×îÁ÷ÐеÄÒ»ÖÖ¼¼ÊõºÍ¹¤ÒÕ¡£
3¡¢PCBA
PCBAÊÇÓ¢ÎÄPrinted Circuit Board +Assembly µÄ¼ò³Æ£¬Ò²¾ÍÊÇ˵PCB¿Õ°å¾¹ýSMTÉϼþ£¬ÔÙ¾¹ýDIP²å¼þµÄÕû¸öÖƳ̣¬¼ò³ÆPCBA .ÕâÊǹúÄÚ³£ÓõÄÒ»ÖÖд·¨£¬¶øÔÚÅ·ÃÀµÄ±ê׼д·¨ÊÇPCB'A£¬¼ÓÁË¡°'¡±£¬Õâ±»³Æ֮Ϊ¹Ù·½Ï°¹ßÓÃÓï¡£
4¡¢FPCÈí°å
FPCÈí°åÊÇÒ»ÖÖ×î¼òµ¥½á¹¹µÄÈáÐԵ緰壬Ö÷ÒªÓÃÓÚºÍÆäËû
µç·°åµÄÁ¬½Ó¡£FPCÈí°åÒ»°ã·ÖΪµ¥²ã°å¡¢Ë«²ã°å¡¢¶à²ã°å¡¢Ë«Ãæ°åµÈ¡£
5¡¢HDI ¸ßÃܶȻ¥Áª
HDI ÊǸßÃܶȻ¥Á¬£¨High Density Interconnector£©µÄËõд£¬ÊÇÉú²úÓ¡ÖÆ°åµÄÒ»ÖÖ£¨¼¼Êõ£©£¬Ê¹ÓÃ΢äÂñ¿×¼¼ÊõµÄÒ»ÖÖÏß··Ö²¼ÃܶȱȽϸߵĵç·°å¡£ HDIרΪСÈÝÁ¿Óû§Éè¼ÆµÄ½ô´ÕÐͲúÆ·¡£Áã»ù´¡Ñ§PCB¹¤³Ìʦ
6¡¢Áã»ù´¡Ñ§PCB¹¤³Ìʦ£¬PTH
PTH (Plating Through Hole) ½ðÊô»¯¿×£¬ËùÒÔÓëÖ®ÏàÁ¬µÄ²ãÊǵ¼Í¨µÄ£»ÓеçÆøÁ¬½Ó¡£ÓëÖ®Ïà¶ÔµÄÊÇNPTH (Non Plating Through Hole) ·Ç½ðÊô»¯¿×£¬ÊÇÖ¸¿×ÄÚ²àûÓÐÍ£»µçÆø¸ô¶Ï¡£
7¡¢º¸ÅÌ
º¸ÅÌͼÐμò³Æº¸ÅÌ land pattern/pad£ºÎ»ÓÚÓ¡ÖƵç·°åµÄÔª¼þ°²×°Ã棬×÷ΪÏà¶ÔÓ¦µÄ±íÃæ×é×°Ôª¼þ»¥Á¬Óõĵ¼ÌåͼÐΡ£
8¡¢·â×°
·â×° print package£¬ÔÚÓ¡ÖƵç·°åÉÏ°´ÔªÆ÷¼þʵ¼Ê³ß´ç£¨Í¶Ó°£©ºÍÒý½Å¹æ¸ñµÈ×ö³öµÄ£¬Óɶà¸öº¸Å̺ͱíÃæË¿Ó¡×é³ÉµÄÔªÆ÷¼þ×éװͼÐΡ£
9¡¢Í¨¿×
ͨ¿× Through Hole£¬ÓÃÓÚÁ¬½ÓÓ¡ÖƵç·°åÃæ²ãÓëµ×²ãµÄµç¶Æͨ·£¬ÓÚ²å×°Ôª¼þÖ®Óá£
10¡¢DRC
DRC£¨Design Rule Check£©Éè¼Æ¹æÔò¼ì²é£ºÒ»¸ö¼ì²éÉè¼ÆÊÇ·ñ°üº¬´íÎóµÄ³ÌÐò£¬µ±PCB Layout Íê³Éºó¿ÉÒÔÀûÓÃDRC¼ì²éÒÅ©ºÍ´íÎ󣬱ÈÈ磺×ßÏ߶Ì·£¬×ßÏß̫ϸ£¬»òÕß×ê¿×̫С¡£